PTI Blog 2026

Quantum Madness: From Bohr's Shock to the Qubit Revolution-pti

Dr. Anthony O'Sullivan — Thu, 20 Aug 2026 11:55:09 GMT

As we saw in our previous blog, Schrödinger’s Cat: Paradox to Practical Quantum Computing, utilizing just fifty “good qubits” can — in the right setting — easily outsmart the most advanced supercomputers. So, the benefits of this technology are not in doubt. The real challenge is not jumping down the rabbit hole, but ensuring you come out at the other end, in other words effectively resolving the difficulties in successfully exploiting the qualities present in superposition and entanglement. Creating superposition is relatively straightforward. The real nightmare is keeping it there. Equally, maintaining high-quality entanglement brings its own set of headaches. In practice, these difficulties fall into the four broad categories of stability, scale, processing, and software, which we will now consider in turn.

Why Gold-Tin is the Best Solder Alloy-4

jpowell@bonders.com (Janine Powell) — Thu, 20 Aug 2026 11:43:17 GMT

There are literally hundreds of solder alloys available from very low melting points from 38°C to extremely high brazing melting points to over 1000°C. Yet, there is one alloy in particular that stands out and is most commonly used by the majority of users for die attach and lid seal applications. This alloy is gold-tin with an 80% gold (Au) and 20% tin (Sn) composition by mass which is a eutectic alloy, meaning the melting point is the same as the solid point (278°C). Gold-tin is the workhorse of the microelectronics industry for die attach and lid seal.

Gold-Tin AuSn Die Attach

Gold-Tin AuSn lid seal with a
combo lid attached preform

Material Properties:

Why Gold-Tin is the Best Solder Alloy-3

jpowell@bonders.com (Janine Powell) — Thu, 20 Aug 2026 11:42:21 GMT

Gold-Tin AuSn Die Attach

Gold-Tin AuSn lid seal with a
combo lid attached preform

Material Properties:

Why Gold-Tin is the Best Solder Alloy-2

jpowell@bonders.com (Janine Powell) — Thu, 20 Aug 2026 11:41:32 GMT

Gold-Tin AuSn Die Attach

Gold-Tin AuSn lid seal with a
combo lid attached preform

Material Properties:

Why Gold-Tin is the Best Solder Alloy-1

jpowell@bonders.com (Janine Powell) — Thu, 20 Aug 2026 11:38:10 GMT

Gold-Tin AuSn Die Attach

Gold-Tin AuSn lid seal with a
combo lid attached preform

Material Properties:

Palomar Technologies new 8100 Wire Bonder Increases Productivity and Efficiency-PTI

admin123@gmail.com (Admin) — Thu, 20 Aug 2026 10:59:45 GMT

Carlsbad, CA – May 28, 2024 – Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announces its integration of SST Vacuum reflow systems into Palomar’s headquarters in Carlsbad, California. Moving its base of operations from Downey, California to the state-of-the-art facilities in Carlsbad allows SST to improve its manufacturing capacity and operate more efficiently by merging processes and sharing learnings between the two product lines and supporting personnel.